Microelectronics Failure Analysis, Sixth Ed.

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This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.

Topics include:

  • Failure Analysis Process Flow
  • Failure Verification
  • Failure Modes and Failure Classification
  • Special Devices (MEMS, Optoelectronics, Passives)
  • Fault Localization Techniques: Package Level (NDT)
  • Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
  • Deprocessing & Imaging Techniques: Deprocessing
  • General Imaging Techniques
  • Local Deprocessing & Imaging
  • Circuit Edit and Design Modification
  • Material Analysis Techniques
  • Reference Information: Important Topics for Semiconductor Devices
  • Failure Analysis Techniques Roadmap
  • Failure Analysis Operations and Management
  • Appendices: Failure Analysis Terms, Definitions, and Acronyms
  • Industry Standards

Published:
  • 2011-10-01
Specs:
  • Published by ASM International with a Product Code of B-ASM-035, ISBN of 978-1-61503-726-1.
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